Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850126 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Hao-Yi Tsai, Yu-Jen Cheng | 2017-12-26 |
| 9837346 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Chen-Shien Chen | 2017-12-05 |
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Tsung-Ding Wang | 2017-10-31 |
| 9735130 | Chip packages and methods of manufacture thereof | Kuo Lung Pan, Ying-Jui Huang, Chen-Shien Chen | 2017-08-15 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9673184 | Packages with molding material forming steps | Yu-Chen Hsu, Chun-Hung Lin, Han-Ping Pu | 2017-06-06 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Kuo Lung Pan, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9640521 | Multi-die package with bridge layer and method for making the same | Wei Sen Chang, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-02 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2017-04-25 |
| 9607959 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Chen-Shien Chen | 2017-03-28 |
| 9589941 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2017-03-07 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Kuei-Wei Huang, Chen-Shien Chen | 2017-03-07 |
| 9576874 | Semiconductor devices and methods of manufacture thereof | Kai-Chiang Wu, Chun-Lin Lu, Hung-Jui Kuo | 2017-02-21 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-01-31 |
| 9559076 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Yu-Min Liang | 2017-01-31 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Tsung-Shu Lin, Han-Ping Pu, Hsien-Wei Chen | 2017-01-24 |