Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780046 | Seal rings structures in semiconductor device interconnect layers and methods of forming the same | Hsin-Yu Pan, Pei-Haw Tsao, Yu-Chen Hsu | 2017-10-03 |
| 9673184 | Packages with molding material forming steps | Yu-Chen Hsu, Chun-Hung Lin, Yu-Feng Chen | 2017-06-06 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng +2 more | 2017-05-30 |
| 9653406 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2017-05-16 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen | 2017-04-11 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Yu-Feng Chen, Tsung-Shu Lin, Hsien-Wei Chen | 2017-01-24 |