Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2017-10-03 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |