Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9607936 | Copper bump joint structures with improved crack resistance | Ching-Wen Hsiao, Jiun Yi Wu, Chen-Shien Chen | 2017-03-28 |