Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748361 | Integrated circuits using guard rings for ESD systems, and methods for forming the integrated circuits | Jian-Hsing Lee, Yu-Chang Jong, Chun-Chien Tsai | 2017-08-29 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Hsien-Wei Chen | 2017-05-23 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |