Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780009 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2017-10-03 |
| 9773732 | Method and apparatus for packaging pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2017-09-26 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Ming-Da Cheng, Wen-Hsiung Lu, Yu-Peng Tsai | 2017-09-05 |
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chung-Shi Liu | 2017-07-04 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |