Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786622 | Semiconductor package | Ming-Da Cheng, Chih-Wei Lin, Kuei-Wei Huang, Chun-Cheng Lin, Chung-Shi Liu | 2017-10-10 |
| 9768048 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Chia-Wei Tu, Ming-Da Cheng, Wen-Hsiung Lu | 2017-09-05 |
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9679790 | Singulation apparatus and method | Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-06-13 |
| 9627369 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Wen-Hsiung Lu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |