Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847317 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Chih-Fan Huang, Ming-Da Cheng | 2017-12-19 |
| 9768048 | Package on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9750140 | Display device | Hung-Kun Chen, Po-Hung Shen, Shih-Hsiung Wu, Jui-Chu LAI, Huan-Kuang PENG +3 more | 2017-08-29 |
| 9659973 | Display device | Hung-Kun Chen, Hong-Kang Chang, Hsieh-Li Chou, Yi-Chien Kao, Li-Wei Sung +1 more | 2017-05-23 |
| 9653482 | Display panel and display device | Hsin-Hung Lin, Li-Wei Sung | 2017-05-16 |
| 9633958 | Bonding pad surface damage reduction in a formation of digital pattern generator | Chih Wei Lu, Tsung-Chih Chien, Tien-I Bao | 2017-04-25 |
| 9632375 | Display device | Hung-Kun Chen, Yi-Chin Lee, Hong-Kang Chang, Yi-Chien Kao, Jui-Ching Chu +1 more | 2017-04-25 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |
| 9627234 | Method and apparatus for localized and controlled removal of material from a substrate | Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9576830 | Method and apparatus for adjusting wafer warpage | Chih-Wei Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Yu-Peng Tsai, Wen-Hsiung Lu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |