Issued Patents 2017
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9837435 | Three-dimensional non-volatile memory structure and manufacturing method thereof | Chun-Yen Chang, Chun-Hu Cheng, Yu-Chien Chiu, Chien-Hsin Liu | 2017-12-05 |
| 9821196 | Luminous ball | — | 2017-11-21 |
| 9812194 | Decoding method, memory storage device and memory control circuit unit | Yu-Cheng Hsu, Szu-Wei Chen | 2017-11-07 |
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Ming-Da Cheng | 2017-10-24 |
| 9776048 | Light releasing sphere structure | — | 2017-10-03 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-12 |
| 9715429 | Decoding method, memory storage device and memory control circuit unit | — | 2017-07-25 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen | 2017-07-18 |
| 9703698 | Data writing method, memory controller and memory storage apparatus | Kuo-Yi Cheng, Kim-Hon Wong, Hao-Zhi Lee, Hung-Chun Lin, Chun-Yen Chang | 2017-07-11 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |
| 9639419 | Read voltage level estimating method, memory storage device and memory control circuit unit | Tien-Ching Wang, Kuo-Hsin Lai | 2017-05-02 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |
| 9612630 | Flash drive | — | 2017-04-04 |
| 9607704 | Data reading method, memory controlling circuit unit and memory storage device | Tien-Ching Wang, Kuo-Hsin Lai | 2017-03-28 |
| 9582224 | Memory control circuit unit, memory storage apparatus and data accessing method | Kuo-Hsin Lai, Tien-Ching Wang | 2017-02-28 |
| 9583464 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Ming-Da Cheng | 2017-02-28 |
| 9583217 | Decoding method, memory storage device and memory control circuit unit | Shao-Wei Yen, Yu-Hsiang Lin, Kuo-Hsin Lai | 2017-02-28 |
| D779438 | Electrical connector | Hung-I Chung | 2017-02-21 |
| 9563508 | Memory management method, memory control circuit unit and memory storage apparatus | Yu-Cheng Hsu, An-Cheng Liu, Siu Tung Lam | 2017-02-07 |
| 9559064 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Yu-Peng Tsai, Wen-Hsiung Lu, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |
| 9543185 | Packaging process tools and systems, and packaging methods for semiconductor devices | Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-10 |
| 9536818 | Semiconductor package and method of forming the same | Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu | 2017-01-03 |