Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9817149 | Vehicle inspection system | Jianmin Li, Ying Li, Yuanjing Li, Yulan Li, Tao Song +1 more | 2017-11-14 |
| 9793230 | Semiconductor structure and method of forming | Chen-Hua Yu, Hung-Jui Kuo | 2017-10-17 |
| 9786617 | Chip packages and methods of manufacture thereof | Zi-Jheng Liu, Chen-Cheng Kuo, Chung-Shi Liu, Hung-Jui Kuo | 2017-10-10 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-09-12 |
| 9741586 | Method of fabricating package structures | Chung-Shi Liu, Hung-Jui Kuo, Sih-Hao Liao | 2017-08-22 |
| 9659805 | Fan-out interconnect structure and methods forming the same | Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng | 2017-05-23 |
| 9570413 | Packages with solder ball revealed through laser | Wei-Yu Chen, Ming-Da Cheng, Hung-Jui Kuo, Chung-Shi Liu | 2017-02-14 |
| 9559064 | Warpage control in package-on-package structures | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |