Issued Patents 2017
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853008 | Connecting techniques for stacked CMOS devices | Hsiang-Jen Tseng, Ting-Wei Chiang, Li-Chun Tien | 2017-12-26 |
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Yu-Hsiang Hu, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, Li-Hsien Huang, An-Jhih Su, Ying-Ju Chen | 2017-11-28 |
| 9825007 | Chip package structure with molding layer and method for forming the same | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen | 2017-11-21 |
| 9812337 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su | 2017-11-07 |
| 9810880 | Imaging optical system, image capturing apparatus and electronic device | Po-Lun Hsu, Cheng-Chen Lin | 2017-11-07 |
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang, Li-Hsien Huang | 2017-10-31 |
| 9793231 | Under bump metallurgy (UBM) and methods of forming same | Hsien-Wei Chen, An-Jhih Su, Cheng-Hsien Hsieh | 2017-10-17 |
| 9791670 | Optical lens, image capturing device and electronic device | Cheng-Chen Lin | 2017-10-17 |
| 9791666 | Imaging optical system, image capturing apparatus and electronic device | Dung-Yi Hsieh | 2017-10-17 |
| 9768136 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9766433 | Photographing optical lens assembly, image capturing unit and electronic device | — | 2017-09-19 |
| 9766892 | Method and apparatus for efficient execution of nested branches on a graphics processor unit | Guei-Yuan Lueh, Subramaniam Maiyuran | 2017-09-19 |
| 9759892 | Imaging optical lens assembly, image capturing apparatus and electronic device | Chih-Wen Hsu | 2017-09-12 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-09-12 |
| 9733455 | Optical image lens assembly, image capturing device and electronic device | Lin-Yao Liao | 2017-08-15 |
| 9726857 | Optical photographing lens assembly, image capturing device and electronic device | — | 2017-08-08 |
| 9717092 | Method and apparatus for allocating resources for device-to-device (D2D) communication in a wireless communication system | Li-Te Pan, Richard Lee-Chee Kuo | 2017-07-25 |
| 9706093 | Photographing system, image capturing unit and electronic device | — | 2017-07-11 |
| 9702750 | Material level indicator | I-Chu Lin, Liang-Chi Chang, Chun-Han Huang, Yi-Liang Hou | 2017-07-11 |
| 9696522 | Photographing optical lens assembly, image capturing device and electronic device | Chun-Yen Chen | 2017-07-04 |
| 9685588 | Light-emitting element having a reflective structure with high efficiency | Wen-Luh Liao, Shao-Ping Lu, Hung-Ta Cheng, Shih-I Chen, Chia-Liang Hsu +5 more | 2017-06-20 |
| 9678315 | Photographing optical lens system, image capturing unit and electronic device | — | 2017-06-13 |
| 9671591 | Optical lens assembly, image capturing apparatus and electronic device | — | 2017-06-06 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |