Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842788 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2017-12-12 |
| 9818720 | Structure and formation method for chip package | Wen-Hsin Wei, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-11-14 |
| 9812381 | Integrated fan-out package and method of fabricating the same | Chun-Yi Liu, Der-Chyang Yeh, Hsien-Wei Chen, Shih-Peng Tai, Chuen-De Wang | 2017-11-07 |
| 9812337 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2017-11-07 |
| 9805984 | FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Chen Kuang-Hsin | 2017-10-31 |
| 9806058 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-10-31 |
| 9768133 | Semiconductor package and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2017-09-19 |
| 9741690 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2017-08-22 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2017-08-15 |
| 9659863 | Semiconductor devices, multi-die packages, and methods of manufacture thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Der-Chyang Yeh, Shih-Peng Tai | 2017-05-23 |
| 9659810 | Method of making a FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Chen Kuang-Hsin | 2017-05-23 |
| 9653427 | Integrated circuit package with probe pad structure | Chen-Hua Yu, Hsiang-Fan Lee, Shih-Peng Tai, Tang-Jung Chiu, Wen-Chih Chiou | 2017-05-16 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, Szu-Po Huang, An-Jhih Su, Hsiang-Fan Lee +2 more | 2017-02-28 |
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2017-01-31 |