Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818720 | Structure and formation method for chip package | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Shang-Yun Hou, Wei-Ming Chen | 2017-11-14 |
| 9806058 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Shang-Yun Hou, Wei-Ming Chen | 2017-10-31 |
| 9741669 | Forming large chips through stitching | Wen-Hsin Wei, Shang-Yun Hou, Wei-Ming Chen | 2017-08-22 |
| 9691840 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +2 more | 2017-06-27 |
| 9653531 | Methods of manufacturing a package | Hsiao-Tsung Yen, Min-Chie Jeng, Tzuan-Horng Liu, Chin-Wei Kuo, Chung-Yu Lu +1 more | 2017-05-16 |
| 9627223 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shih-Wen Huang, Shang-Yun Hou +1 more | 2017-04-18 |
| 9618572 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2017-04-11 |
| 9589857 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2017-03-07 |