Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818720 | Structure and formation method for chip package | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou | 2017-11-14 |
| 9806058 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou | 2017-10-31 |
| 9741669 | Forming large chips through stitching | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou | 2017-08-22 |
| 9698115 | Three-dimensional chip stack and method of forming the same | Cheng-Hsien Hsieh, Sung-Hui Huang, Kuo-Ching Hsu | 2017-07-04 |
| 9668311 | Integrated circuits for AC LED lamps and control methods thereof | — | 2017-05-30 |
| 9661696 | AC LED lighting systems and control methods efficiently providing operating voltage | Jing Wang | 2017-05-23 |