Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9760670 | Semiconductor device design methods and conductive bump pattern enhancement methods | Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2017-09-12 |
| 9698115 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang | 2017-07-04 |
| 9633869 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2017-04-25 |
| RE46330 | Driving apparatus of light emitting diode and driving method thereof | Chin-Hsun Hsu, Tsung-Hau Chang, Ting-Wei Liao | 2017-02-28 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu +1 more | 2017-02-14 |