Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu, Jung Wei Cheng +2 more | 2017-11-21 |
| 9786567 | Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages | Wei-Cheng Wu, Li-Han Hsu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Lin | 2017-10-10 |
| 9633869 | Packages with interposers and methods for forming the same | Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2017-04-25 |
| 9581638 | Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages | Wei-Cheng Wu, Li-Han Hsu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Lin | 2017-02-28 |