HH

Hao-Cheng Hou

TSMC: 3 patents #685 of 2,832Top 25%
Overall (2017): #77,779 of 506,227Top 20%
3
Patents 2017

Issued Patents 2017

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9824902 Integrated fan-out package and method of fabricating the same Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu, Jung Wei Cheng, Ping-Kang Huang +2 more 2017-11-21
9691723 Connector formation methods and packaged semiconductor devices Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hung-Jen Lin, Chun-Chih Chuang +2 more 2017-06-27
9564416 Package structures and methods of forming the same Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin 2017-02-07