Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837292 | Underfill dispensing with controlled fillet profile | Chun-Chih Chuang, Chun-Hung Lin, Tsung-Ding Wang | 2017-12-05 |
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu, Ping-Kang Huang +2 more | 2017-11-21 |
| 9721916 | Concentric bump design for the alignment in die stacking | Tsung-Ding Wang, Chien-Hsun Lee | 2017-08-01 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2017-06-27 |
| 9653443 | Thermal performance structure for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee | 2017-05-16 |
| 9570368 | Method of manufacturing semiconductor package including forming a recessed region in a substrate | Tsung-Ding Wang, Bo-I Lee | 2017-02-14 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Tsung-Ding Wang, Hung-Jen Lin | 2017-02-07 |