Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754917 | Method of forming wafer-level molded structure for package assembly | Tsung-Ding Wang, Chien-Hsun Lee | 2017-09-05 |
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Kai-Ming Ching, Chien-Hsun Lee | 2017-06-06 |
| 9570368 | Method of manufacturing semiconductor package including forming a recessed region in a substrate | Tsung-Ding Wang, Jung Wei Cheng | 2017-02-14 |