Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Bo-I Lee, Chien-Hsun Lee | 2017-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Bo-I Lee, Chien-Hsun Lee | 2017-06-06 |