Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847320 | Semiconductor structure and method of fabricating the same | Chien-Hsun Chen, William Wu Shen, Jiun Yi Wu | 2017-12-19 |
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chen-Hua Yu, Chung-Shi Liu, Jung Wei Cheng, Ping-Kang Huang +2 more | 2017-11-21 |
| 9807867 | Interconnect structure and method of manufacturing the same | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-31 |
| 9786976 | Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-10 |
| 9768145 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Tsung-Ding Wang | 2017-09-19 |
| 9754917 | Method of forming wafer-level molded structure for package assembly | Tsung-Ding Wang, Bo-I Lee | 2017-09-05 |
| 9721916 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Tsung-Ding Wang | 2017-08-01 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2017-06-27 |
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Kai-Ming Ching, Bo-I Lee | 2017-06-06 |
| 9673158 | Formation of connectors without UBM | Tsung-Ding Wang, Hung-Jen Lin | 2017-06-06 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2017-05-16 |
| 9653443 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii | 2017-05-16 |