Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831634 | Apparatus and method of forming chip package with waveguide for light coupling | Chun-Hao Tseng, Ying-Hao Kuo | 2017-11-28 |
| 9806069 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Ying-Hao Kuo | 2017-10-31 |
| 9799528 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2017-10-24 |
| 9773757 | Devices, packaged semiconductor devices, and semiconductor device packaging methods | Chen-Hua Yu | 2017-09-26 |
| 9768145 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Tsung-Ding Wang, Chien-Hsun Lee | 2017-09-19 |
| 9761513 | Method of fabricating three dimensional integrated circuit | Chun-Hui Yu | 2017-09-12 |
| 9704826 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2017-07-11 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2017-05-16 |
| 9601463 | Fan-out stacked system in package (SIP) and the methods of making the same | Chen-Hua Yu | 2017-03-21 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Chen-Hua Yu, Yeong-Jyh Lin, Chia-Hsiang Lin, Liang-Ju Yen +1 more | 2017-02-28 |
| 9576930 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2017-02-21 |
| 9564420 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Chih-Hang Tung | 2017-02-07 |