Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9834435 | Structure and formation method of semiconductor device structure | Ping-Yin Liu, Xin-Hua Huang, Jung-Huei Peng | 2017-12-05 |
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Chien Ling Hwang, Hsin-Hung Liao | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2017-10-31 |
| 9768142 | Mechanisms for forming bonding structures | Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2017-05-23 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Kuo-Chung Yee, Chen-Hua Yu, Chia-Hsiang Lin, Liang-Ju Yen +1 more | 2017-02-28 |