Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2017-10-31 |
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9700950 | Innovative multi-purpose dipping plate | Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chien Ling Hwang, Chung-Shi Liu | 2017-07-11 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Yeong-Jyh Lin, Hsiao-Chung Liang | 2017-05-23 |