Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842817 | Solder bump stretching method and device for performing the same | Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2017-12-12 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Chien Ling Hwang, Chung-Shi Liu | 2017-07-11 |