Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842817 | Solder bump stretching method and device for performing the same | Su-Chun Yang, Yi-Li Hsiao, Chen-Hua Yu | 2017-12-12 |
| 9735276 | Non-planar transistors and methods of fabrication thereof | Chin-Hsiang Lin, Cheng-Hung Chang, Sey-Ping Sun | 2017-08-15 |
| 9679882 | Method of multi-chip wafer level packaging | Chun-Hui Yu, Chen-Hua Yu, Da-Yuan Shih | 2017-06-13 |
| 9576929 | Multi-strike process for bonding | Tung-Liang Shao, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2017-02-21 |
| 9564420 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Kuo-Chung Yee | 2017-02-07 |