Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812434 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2017-11-07 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9679883 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2017-06-13 |
| 9673270 | Metal insulator metal capacitor and method for making the same | Yu-Chia Lai, Ching-Jung Yang | 2017-06-06 |
| 9576929 | Multi-strike process for bonding | Chih-Hang Tung, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2017-02-21 |
| 9559044 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2017-01-31 |