Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852985 | Conductive terminal on integrated circuit | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-12-26 |
| 9812392 | Inductor system and method | Hsien-Wei Chen, Hao-Yi Tsai, Tsung-Yuan Yu | 2017-11-07 |
| 9799614 | Calibration kits for RF passive devices | Jie Chen, Hao-Yi Tsai, Hsien-Wei Chen | 2017-10-24 |
| 9799615 | Package structures having height-adjusted molding members and methods of forming the same | Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hao-Yi Tsai, Shih-Wei Liang +2 more | 2017-10-24 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Yu-Chia Lai +3 more | 2017-10-10 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9761522 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng | 2017-09-12 |
| 9647054 | Inductor system and method | Hao-Yi Tsai, Hsien-Wei Chen, Tsung-Yuan Yu | 2017-05-09 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Ching-Jung Yang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-05-02 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hsien-Wei Chen, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2017-01-24 |