Issued Patents 2017
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852985 | Conductive terminal on integrated circuit | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-12-26 |
| 9850126 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Yu-Feng Chen, Yu-Jen Cheng | 2017-12-26 |
| 9842815 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2017-12-12 |
| 9831140 | Wafer having pad structure | Ying-Ju Chen, Hsien-Wei Chen, Mirng-Ji Lii | 2017-11-28 |
| 9812392 | Inductor system and method | Hsien-Wei Chen, Hung-Yi Kuo, Tsung-Yuan Yu | 2017-11-07 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-10-31 |
| 9799615 | Package structures having height-adjusted molding members and methods of forming the same | Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo, Shih-Wei Liang +2 more | 2017-10-24 |
| 9799614 | Calibration kits for RF passive devices | Jie Chen, Hsien-Wei Chen, Hung-Yi Kuo | 2017-10-24 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo +3 more | 2017-10-10 |
| 9761522 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chen-Hua Yu, Chung-Shi Liu, Ming Hung Tseng, Hung-Yi Kuo | 2017-09-12 |
| 9728477 | Method of manufacturing a semiconductor device having scribe lines | Nien-Fang Wu, Chao-Wen Shih, Yung-Ping Chiang | 2017-08-08 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Yu-Feng Chen, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9659896 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo +1 more | 2017-05-23 |
| 9653406 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2017-05-16 |
| 9647054 | Inductor system and method | Hsien-Wei Chen, Hung-Yi Kuo, Tsung-Yuan Yu | 2017-05-09 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Ching-Jung Yang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-05-02 |
| 9633963 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Mirng-Ji Lii, Chen-Hua Yu | 2017-04-25 |
| 9633870 | System and method for an improved interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2017-04-25 |
| 9620465 | Dual-sided integrated fan-out package | Kuo Lung Pan, Wei Sen Chang, Tin-Hao Kuo, Chung-Shi Liu | 2017-04-11 |
| 9613914 | Post-passivation interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu | 2017-04-04 |
| 9601446 | Method of fabricating a bond pad structure | Shin-Puu Jeng, Hsien-Wei Chen, Yu-Wen Liu | 2017-03-21 |
| 9601443 | Test structure for seal ring quality monitor | Shih-Hsun Hsu, Shih-Cheng Chang, Shang-Yun Hou, Hsien-Wei Chen, Chia-Lun Tsai +3 more | 2017-03-21 |
| 9589915 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Chao-Wen Shih, Wen-Hsin Chan, Chen-Chih Hsieh | 2017-03-07 |
| 9589941 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu | 2017-03-07 |