Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831205 | Semiconductor device and manufacturing method thereof | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen | 2017-11-28 |
| 9831196 | Methods and apparatus of guard rings for wafer-level-packaging | Hsien-Wei Chen | 2017-11-28 |
| 9812392 | Inductor system and method | Hsien-Wei Chen, Hung-Yi Kuo, Hao-Yi Tsai | 2017-11-07 |
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Ying-Ju Chen, Yu-Feng Chen, Tsung-Ding Wang | 2017-10-31 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2017-10-10 |
| 9679868 | Ball height control in bonding process | Hsien-Wei Chen, Jie Chen | 2017-06-13 |
| 9673160 | Packaging devices, methods of manufacture thereof, and packaging methods | Hsien-Wei Chen | 2017-06-06 |
| 9647054 | Inductor system and method | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2017-05-09 |
| 9633963 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2017-04-25 |
| 9633870 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2017-04-25 |
| 9589915 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Chao-Wen Shih, Wen-Hsin Chan, Chen-Chih Hsieh | 2017-03-07 |
| 9589862 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-03-07 |
| 9559067 | Methods and apparatus of guard rings for wafer-level-packaging | Hsien-Wei Chen | 2017-01-31 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen | 2017-01-24 |