Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768136 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9589862 | Interconnect structures and methods of forming same | Tsung-Yuan Yu, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-03-07 |
| 9536865 | Interconnection joints having variable volumes in package structures and methods of formation thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen +1 more | 2017-01-03 |