Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780064 | Method of forming package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Yian-Liang Kuo | 2017-10-03 |
| 9768136 | Interconnect structure and method of fabricating same | Wei-Yu Chen, Hsuan-Ting Kuo, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Chia-Wei Tu, Ming-Da Cheng, Yu-Peng Tsai | 2017-09-05 |
| 9698028 | Semiconductor package and method of manufacturing the same | Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Kuei-Wei Huang, Chung-Shi Liu | 2017-05-30 |
| 9607921 | Package on package interconnect structure | Yi-Wen Wu, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9598772 | Method for fabricating bump structure without UBM undercut | Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-21 |
| 9589862 | Interconnect structures and methods of forming same | Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-03-07 |
| 9576830 | Method and apparatus for adjusting wafer warpage | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Yu-Peng Tsai, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |