Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780064 | Method of forming package assembly | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9768105 | Rigid interconnect structures in package-on-package assemblies | Mirng-Ji Lii, Chen-Hua Yu, Yung Ching Chen, Jiun Yi Wu | 2017-09-19 |