Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847320 | Semiconductor structure and method of fabricating the same | Chien-Hsun Chen, William Wu Shen, Chien-Hsun Lee | 2017-12-19 |
| 9831207 | No-flow underfill for package with interposer frame | — | 2017-11-28 |
| 9812416 | Semiconductor arrangement and formation thereof | Hsueh-Lung Cheng, Shou-Yi Wang | 2017-11-07 |
| 9807867 | Interconnect structure and method of manufacturing the same | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-31 |
| 9786976 | Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-10 |
| 9768090 | Substrate design for semiconductor packages and method of forming same | Yu-Min Liang, Mirng-Ji Lii | 2017-09-19 |
| 9768105 | Rigid interconnect structures in package-on-package assemblies | Mirng-Ji Lii, Chen-Hua Yu, Chien-Hsiun Lee, Yung Ching Chen | 2017-09-19 |
| 9691636 | Interposer frame and method of manufacturing the same | — | 2017-06-27 |
| 9659918 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Dean Wang, Chen-Shien Chen, Chung-Shi Liu | 2017-05-23 |
| 9659881 | Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion | Yu-Min Liang | 2017-05-23 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2017-05-16 |
| 9646928 | Semiconductor arrangement and formation thereof | Hsueh-Lung Cheng, Shou-Yi Wang | 2017-05-09 |
| 9646922 | Methods and apparatus for thinner package on package structures | — | 2017-05-09 |
| 9607936 | Copper bump joint structures with improved crack resistance | Ching-Wen Hsiao, Ru-Ying Huang, Chen-Shien Chen | 2017-03-28 |
| 9589924 | Semiconductor structure and method of manufacturing the same | Yu-Min Liang | 2017-03-07 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jing Ruei Lu, Po-Yao Lin, Ming-Chih Yew | 2017-02-28 |