Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768090 | Substrate design for semiconductor packages and method of forming same | Mirng-Ji Lii, Jiun Yi Wu | 2017-09-19 |
| 9659881 | Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion | Jiun Yi Wu | 2017-05-23 |
| 9589924 | Semiconductor structure and method of manufacturing the same | Jiun Yi Wu | 2017-03-07 |
| 9559076 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Yu-Feng Chen | 2017-01-31 |