Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793242 | Packages with die stack including exposed molding underfill | Yu-Chih Liu, Hai-Ming Chen, Wei-Ting Lin, Tsung-Ding Wang | 2017-10-17 |
| 9666556 | Flip chip packaging | Yu-Chih Liu, Chien-Kuo Chang, Chi-Yang Yu, Chih-Hao Lin | 2017-05-30 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng +1 more | 2017-04-18 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jiun Yi Wu, Po-Yao Lin, Ming-Chih Yew | 2017-02-28 |