Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu | 2017-11-07 |
| 9666556 | Flip chip packaging | Yu-Chih Liu, Chien-Kuo Chang, Jing Ruei Lu, Chih-Hao Lin | 2017-05-30 |