Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Kuan-Lin Ho, Chi-Yang Yu, Yu-Chih Liu | 2017-11-07 |
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Yu-Chih Liu, Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Shih-Yen Lin | 2017-10-31 |
| 9786520 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Chang-Chia Huang, Shih-Yen Lin, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9735043 | Semiconductor packaging structure and process | Kuan-Lin Ho, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2017-08-15 |
| 9673119 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Wei-Ting Lin, Kuan-Lin Ho | 2017-06-06 |