Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786520 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9691686 | Contact pad for semiconductor device | Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2017-06-27 |
| 9613931 | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same | Tsung-Shu Lin, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2017-04-04 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-02-28 |