Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu | 2017-12-12 |
| 9806038 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Tsung-Shu Lin | 2017-10-31 |
| 9741638 | Thermal structure for integrated circuit package | Shin-Puu Jeng, Shang-Yun Hou, Way Lee Cheng | 2017-08-22 |
| 9722109 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu +2 more | 2017-08-01 |
| 9711478 | Semiconductor device with an anti-pad peeling structure and associated method | Chih-Kai Cheng, Shih-Wen Huang | 2017-07-18 |
| 9691686 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2017-06-27 |
| 9640490 | Through silicon via keep out zone formation method and system | Hung-An Teng, Shang-Yun Hou, Shin-Puu Jeng | 2017-05-02 |
| 9613931 | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same | Tsung-Shu Lin, Hsien-Wei Chen, Chang-Chia Huang | 2017-04-04 |