Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2017-12-12 |
| 9831177 | Through via structure | Yung-Chi Lin, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2017-11-28 |
| 9811065 | Human detection system and human detection method | Meng-Seng Chen, Tien-Szu Lo | 2017-11-07 |
| 9804968 | Storage system and data writing method | Tz-Yu Fu, Po-Wei Wu | 2017-10-31 |
| 9786580 | Self-alignment for redistribution layer | Ku-Feng Yang, Ming-Tsu Chung, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai +2 more | 2017-10-10 |
| 9773701 | Methods of making integrated circuits including conductive structures through substrates | Yuan-Hung Liu, Ku-Feng Yang, Pei-Ching Kuo, Ming-Tsu Chung, Tsang-Jiuh Wu +1 more | 2017-09-26 |
| 9748190 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Lin-Chih Huang, Tsang-Jiuh Wu, Tasi-Jung Wu, Wen-Chih Chiou | 2017-08-29 |
| 9698218 | Method for forming semiconductor structure | Sheng-Hao Lin, Huai-Tzu Chiang, Hao-Ming Lee | 2017-07-04 |
| 9679859 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Yung-Chi Lin, Ku-Feng Yang +2 more | 2017-06-13 |
| 9627268 | Method for fabricating semiconductor device | Ching-Yu Chang, Li-Wei Feng, Shih-Hung Tsai, Ssu-I Fu, Jyh-Shyang Jenq +4 more | 2017-04-18 |
| 9627022 | Double pumped memory techniques | Andy Wangkun Chen, Sabarish Ittamveetil, Yew Keong Chong, Indranil Basu, Yew Keong Vikash | 2017-04-18 |
| 9554059 | Exposure control system and associated exposure control method | Chin-An Lin, Chung-Te Li, Keng-Sheng Lin, Hao Wang | 2017-01-24 |