Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2017-12-12 |
| 9640490 | Through silicon via keep out zone formation method and system | Cheng-Chieh Hsieh, Shang-Yun Hou, Shin-Puu Jeng | 2017-05-02 |
| 9553053 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen +1 more | 2017-01-24 |