Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842825 | Substrateless integrated circuit packages and methods of forming same | Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2017-12-12 |
| 9831177 | Through via structure | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2017-11-28 |
| 9748190 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Tsang-Jiuh Wu, Tasi-Jung Wu, Wen-Chih Chiou | 2017-08-29 |
| 9679859 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2017-06-13 |
| 9564345 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2017-02-07 |