Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Yung-Shou Cheng, Yan-Fu Lin, An-Jhih Su, Wei-Cheng Wu, Chin-Hsien Chen +2 more | 2017-12-26 |
| 9831200 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2017-11-28 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen | 2017-11-28 |
| 9825007 | Chip package structure with molding layer and method for forming the same | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2017-11-21 |
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang | 2017-10-31 |
| 9793246 | Pop devices and methods of forming the same | Hua-Wei Tseng, An-Jhih Su, Hsien-Wei Chen, Tien-Chung Yang | 2017-10-17 |
| 9666522 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2017-05-30 |
| 9564345 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su | 2017-02-07 |