Issued Patents 2017
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852998 | Ring structures in device die | Jie Chen, Hsien-Wei Chen | 2017-12-26 |
| 9842788 | Underfill control structures and method | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2017-12-12 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, Li-Hsien Huang, An-Jhih Su, Wei-Yu Chen | 2017-11-28 |
| 9831205 | Semiconductor device and manufacturing method thereof | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2017-11-28 |
| 9831140 | Wafer having pad structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2017-11-28 |
| 9825008 | Package-on-package device with supplemental underfill and method for manufacturing the same | Jie Chen, Hsien-Wei Chen | 2017-11-21 |
| 9812430 | Package on-package method | Hsien-Wei Chen, An-Jhih Su | 2017-11-07 |
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang | 2017-10-31 |
| 9806235 | Light emitting diode bracket | Ching-Huei Wu, Chih-Chao Chang, Ping Wu | 2017-10-31 |
| 9793245 | Semiconductor device and method of manufacture | Hsien-Wei Chen, An-Jhih Su, Jie Chen | 2017-10-17 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9773745 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2017-09-26 |
| 9687438 | Method for enhancing collagen secretion and preventing cutaneous aging using chenopodium formosanum extract | Hsiang-Ling Su, Chin-Hsiu Yu | 2017-06-27 |
| 9646941 | Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof | Hsien-Wei Chen | 2017-05-09 |
| 9620469 | Mechanisms for forming post-passivation interconnect structure | Hsien-Wei Chen | 2017-04-11 |
| 9589938 | Semiconductor device including an embedded surface mount device and method of forming the same | Hsien-Wei Chen | 2017-03-07 |
| 9589891 | Contact pad for semiconductor devices | Hsien-Wei Chen, Jie Chen | 2017-03-07 |
| 9570418 | Structure and method for package warpage control using dummy interconnects | Hsien-Wei Chen | 2017-02-14 |
| 9553066 | Post passivation interconnect structures and methods for forming the same | Hsien-Wei Chen | 2017-01-24 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Tsung-Yuan Yu | 2017-01-24 |
| 9549054 | Information displaying method, mobile phone, and storage device | Yuan-Mao Tsui, Chi-Min Lee | 2017-01-17 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hsien-Wei Chen, Hao-Yi Tsai, Yu-Wen Liu | 2017-01-03 |