Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9536847 | Bump pad structure | Hsien-Wei Chen, Hao-Yi Tsai, Ying-Ju Chen, Yu-Wen Liu | 2017-01-03 |
HW
Hsiu-Ping Wei
Overall (2017): #397,614 of 506,227Top 80%
1
Patents 2017