Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646954 | Integrated circuit with test circuit | Shih-Wei Liang, Hsien-Wei Chen | 2017-05-09 |
| 9601446 | Method of fabricating a bond pad structure | Shin-Puu Jeng, Hsien-Wei Chen, Hao-Yi Tsai | 2017-03-21 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hsien-Wei Chen, Hao-Yi Tsai, Ying-Ju Chen | 2017-01-03 |