Issued Patents 2017
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852998 | Ring structures in device die | Ying-Ju Chen, Hsien-Wei Chen | 2017-12-26 |
| 9837379 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2017-12-05 |
| 9831214 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen | 2017-11-28 |
| 9831205 | Semiconductor device and manufacturing method thereof | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2017-11-28 |
| 9825008 | Package-on-package device with supplemental underfill and method for manufacturing the same | Ying-Ju Chen, Hsien-Wei Chen | 2017-11-21 |
| 9820020 | Grooming method and device for packet optical transport network | Xuegang Ou, Xin Si, Hongbin Yu, Wei Luo, Xingming Li | 2017-11-14 |
| 9799614 | Calibration kits for RF passive devices | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2017-10-24 |
| 9793245 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Ying-Ju Chen, An-Jhih Su | 2017-10-17 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2017-10-10 |
| 9768133 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2017-09-19 |
| 9755667 | Methods and systems for parallelizing high throughput iterative decoders | Haoting Luo, Engling Yeo | 2017-09-05 |
| 9754910 | Methods of packaging semiconductor devices and packaged semiconductor devices | Hsien-Wei Chen | 2017-09-05 |
| 9735129 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2017-08-15 |
| 9728517 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2017-08-08 |
| 9704972 | Semiconductor structures and fabrication method thereof | Qiuhua Han | 2017-07-11 |
| 9704739 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen | 2017-07-11 |
| 9679868 | Ball height control in bonding process | Tsung-Yuan Yu, Hsien-Wei Chen | 2017-06-13 |
| 9666502 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2017-05-30 |
| 9666553 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2017-05-30 |
| 9633961 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen | 2017-04-25 |
| 9613857 | Electrostatic discharge protection structure and method | Hsien-Wei Chen | 2017-04-04 |
| 9589903 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2017-03-07 |
| 9589891 | Contact pad for semiconductor devices | Hsien-Wei Chen, Ying-Ju Chen | 2017-03-07 |
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu | 2017-01-24 |
| 9553001 | Method of forming a molding layer for semiconductor package | Hsien-Wei Chen | 2017-01-24 |