CL

Chi-Jung Lee

TSMC: 1 patents #1,425 of 2,832Top 55%
📍 Taoyuan, VA: #1 of 1 inventorsTop 100%
Overall (2017): #462,871 of 506,227Top 95%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9806059 Multi-stack package-on-package structures Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang 2017-10-31