Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Li-Hsien Huang | 2017-10-31 |
| 9793246 | Pop devices and methods of forming the same | Hua-Wei Tseng, An-Jhih Su, Hsien-Wei Chen, Li-Hsien Huang | 2017-10-17 |
| 9659878 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Jo-Mei Wang | 2017-05-23 |
| 9564345 | Semiconductor device and manufacturing method thereof | Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2017-02-07 |